The Torbo® Electronic Substrate made by China factory is used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight. Their extremely high strength also makes them a key m......
The Torbo® Electronic Substrate made by China factory is used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight. Their extremely high strength also makes them a key material that increases the life and reliability of the products they are used in.
The Torbo® Electronic Substrate
Item:Silicon nitride substrate
Material:Si3N4
Color:Gray
Thickness:0.25-1mm
Surface processing:Double polished
Bulk density: 3.24g/㎤
Surface roughness Ra: 0.4μm
Bending strength: (3-point method):600-1000Mpa
Modulus of elasticity:310Gpa
Fracture toughness(IF method):6.5 MPa・√m
Thermal conductivity: 25°C 15-85 W/(m・K)
Dielectric loss factor:0.4
Volume resistivity: 25°C >1014 Ω・㎝
Breakdown strength:DC >15㎸/㎜